
Thermal paste forms a continuous, conductive layer between a processor and its heat sink, improving cooling performance and keeping your important chips from overheating.
Whenever you remove a heat sink, it’s very important to remove the old thermal paste and apply a new layer.
Specifications:
Compatibility
This part is compatible with All machines requiring gray thermal paste..
Whenever you remove a heat sink, it’s very important to remove the old thermal paste and apply a new layer.
Specifications:
- Density: 2.3 g/cm3
- Thermal Conductivity: 6.5 W/m-K
- Operation temperature Range: -30 - 150°C
- Non Electrically Conductive
- Non curing, no bleedout
- Easy application and spreadability
- A blend of carbon and ceramic particles in a silicone polymer matrix
- Thermal Paste
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Compatibility
This part is compatible with All machines requiring gray thermal paste..